Bapco CPH

deep melt

Deepmelt series
Packaging adhesive based on synthetic resins. The raw materials used comply with FDA guidelines 21 CFR 175.105. The Deepmelt series is characterized by low application temperatures.

Depending on the product, the Deepmelt product range has the following properties:

  • Gluing cardboard and folding boxes
  • Can be used at low temperatures (application from 90°C)
  • Good thermal stability
  • Due to reduced energy consumption, Deepmelt contributes to relieving the burden on the environment
  • High operator safety due to low temperatures
  • Reduced maintenance costs
  • Low cost-in-use packaging adhesive
Industrial applications